access via network - tradução para russo
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access via network - tradução para russo

PART OF A TELECOMMUNICATION NETWORK
Access charge; Access denial; Access failure; System blocking; Access attempt; Access Charge; Access networks; Access attempt (communications); Access in telecommunications; Network access; Access (telecommunications); Access Network; Optical distribution network; Optical Distribution Network; Optical access network
  • Access Network Authentication High-Level Example

access via network      
доступ через сеть связи
blind via         
  • PCB via current capacity chart showing 1 mil plating via current capacity & resistance versus diameter on a 1.6 mm PCB.
  • Different types of vias:<br/> ('''1''') [[Through hole]].<br/> ('''2''') Blind via.<br/> ('''3''') Buried via.<br/>The gray and green layers are nonconducting, while the thin orange layers and red vias are conductive.
CONNECTION BETWEEN LAYERS IN AN ELECTRONIC CIRCUIT
Blind via; Thermal via; Castellated Hole; Via hole; Vertical interconnect access; Vertical Interconnect Access; VIA (electronics); Buried via; Deep vertical interconnect access; DVIA (electronics); Castellated hole; Plugged via; Stacked via; Staggered via; Filled via; Capped via; Tented via; Via-hole; Non-through via; Non-thru via; Non Through Via; Through Via; Through via; Non-through via hole; Non-thru via hole; Through via hole; Via-in-pad; Via plugging; Via tenting; Via filling; Tented & covered via; Tented and covered via; Covered via; Plugged buried via; Plugged & covered via; Plugged and covered via; Filled & covered via; Filled and covered via; Filled & capped via; Filled and capped via; Microvia filling; Filled microvia; Micro-via filling; Filled micro-via; Via capping; Via cap; Via fill; Via plug; Copper capped via; Blind micro via; Blind microvia; Through-glass via; Tenting via; LPI tenting; Liquid photoimageable solder mask tenting; Tenting (via); PCB via tenting; Tent a via; Tenting a via; PCB Via; Covered annular ring; Type I via; IPC type I via; IPC 4761 type I via; IPC 4761 type I; IPC 4761 Type I; Type II via; IPC type II via; IPC 4761 type II via; IPC 4761 type II; IPC 4761 Type II; Type III via; IPC type III via; IPC 4761 type III via; IPC 4761 type III; IPC 4761 Type III; Type III-a via; IPC type III-a via; IPC 4761 type III-a via; IPC 4761 type III-a; IPC 4761 Type III-a; Type III-b via; IPC type III-b via; IPC 4761 type III-b via; IPC 4761 type III-b; IPC 4761 Type III-b; Type IV via; IPC type IV via; IPC 4761 type IV via; IPC 4761 type IV; IPC 4761 Type IV; Type IV-a via; IPC type IV-a via; IPC 4761 type IV-a via; IPC 4761 type IV-a; IPC 4761 Type IV-a; Type IV-b via; IPC type IV-b via; IPC 4761 type IV-b via; IPC 4761 type IV-b; IPC 4761 Type IV-b; Type V via; IPC type V via; IPC 4761 type V via; IPC 4761 type V; IPC 4761 Type V; Type VI via; IPC type VI via; IPC 4761 type VI via; IPC 4761 type VI; IPC 4761 Type VI; Type VI-a via; IPC type VI-a via; IPC 4761 type VI-a via; IPC 4761 type VI-a; IPC 4761 Type VI-a; Type VI-b via; IPC type VI-b via; IPC 4761 type VI-b via; IPC 4761 type VI-b; IPC 4761 Type VI-b; Type VII via; IPC type VII via; IPC 4761 type VII via; IPC 4761 type VII; IPC 4761 Type VII; IPC 4761; Padstack; Pad stack; Via stack; Viastack; Thermovia

общая лексика

глухое переходное отверстие

в САПР электроники - несквозное переходное отверстие, которое достигает только одного внешнего слоя печатной платы

Смотрите также

bured via; through via; via; via grid

through via         
  • PCB via current capacity chart showing 1&nbsp;mil plating via current capacity & resistance versus diameter on a 1.6&nbsp;mm PCB.
  • Different types of vias:<br/> ('''1''') [[Through hole]].<br/> ('''2''') Blind via.<br/> ('''3''') Buried via.<br/>The gray and green layers are nonconducting, while the thin orange layers and red vias are conductive.
CONNECTION BETWEEN LAYERS IN AN ELECTRONIC CIRCUIT
Blind via; Thermal via; Castellated Hole; Via hole; Vertical interconnect access; Vertical Interconnect Access; VIA (electronics); Buried via; Deep vertical interconnect access; DVIA (electronics); Castellated hole; Plugged via; Stacked via; Staggered via; Filled via; Capped via; Tented via; Via-hole; Non-through via; Non-thru via; Non Through Via; Through Via; Through via; Non-through via hole; Non-thru via hole; Through via hole; Via-in-pad; Via plugging; Via tenting; Via filling; Tented & covered via; Tented and covered via; Covered via; Plugged buried via; Plugged & covered via; Plugged and covered via; Filled & covered via; Filled and covered via; Filled & capped via; Filled and capped via; Microvia filling; Filled microvia; Micro-via filling; Filled micro-via; Via capping; Via cap; Via fill; Via plug; Copper capped via; Blind micro via; Blind microvia; Through-glass via; Tenting via; LPI tenting; Liquid photoimageable solder mask tenting; Tenting (via); PCB via tenting; Tent a via; Tenting a via; PCB Via; Covered annular ring; Type I via; IPC type I via; IPC 4761 type I via; IPC 4761 type I; IPC 4761 Type I; Type II via; IPC type II via; IPC 4761 type II via; IPC 4761 type II; IPC 4761 Type II; Type III via; IPC type III via; IPC 4761 type III via; IPC 4761 type III; IPC 4761 Type III; Type III-a via; IPC type III-a via; IPC 4761 type III-a via; IPC 4761 type III-a; IPC 4761 Type III-a; Type III-b via; IPC type III-b via; IPC 4761 type III-b via; IPC 4761 type III-b; IPC 4761 Type III-b; Type IV via; IPC type IV via; IPC 4761 type IV via; IPC 4761 type IV; IPC 4761 Type IV; Type IV-a via; IPC type IV-a via; IPC 4761 type IV-a via; IPC 4761 type IV-a; IPC 4761 Type IV-a; Type IV-b via; IPC type IV-b via; IPC 4761 type IV-b via; IPC 4761 type IV-b; IPC 4761 Type IV-b; Type V via; IPC type V via; IPC 4761 type V via; IPC 4761 type V; IPC 4761 Type V; Type VI via; IPC type VI via; IPC 4761 type VI via; IPC 4761 type VI; IPC 4761 Type VI; Type VI-a via; IPC type VI-a via; IPC 4761 type VI-a via; IPC 4761 type VI-a; IPC 4761 Type VI-a; Type VI-b via; IPC type VI-b via; IPC 4761 type VI-b via; IPC 4761 type VI-b; IPC 4761 Type VI-b; Type VII via; IPC type VII via; IPC 4761 type VII via; IPC 4761 type VII; IPC 4761 Type VII; IPC 4761; Padstack; Pad stack; Via stack; Viastack; Thermovia

общая лексика

сквозное переходное отверстие в печатной плате

Смотрите также

PCB; via grid

Definição

Аппиева дорога
(via Appia)

первая римская мощёная дорога (протяжённость ок. 350 км). Была проложена со стратегической целью при цензоре 312 до н. э. Аппии Клавдии (откуда её название) между Римом и Капуей; позже (в 244 до н. э.) доведена до Брундизия. А. д. была выложена из квадратных камней, по ней свободно могли проехать, не сталкиваясь, два воза. Вдоль А. д. (около Рима) сохранились памятники древнего некрополя (кладбища) языческого и раннехристианского времени.

Аппиева дорога.

Wikipédia

Access network

An access network is a type of telecommunications network which connects subscribers to their immediate service provider. It is contrasted with the core network, which connects local providers to one another. The access network may be further divided between feeder plant or distribution network, and drop plant or edge network.

Como se diz access via network em Russo? Tradução de &#39access via network&#39 em Russo